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Your search returned 29 records. Click on the hyperlinks to view further details of Titles.. |
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Magazine Name : Ieee Transactions On Components, Packaging, And Manufacturing Technology Part-B: Advanced Packaging
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Year : 1995 Volume number : 18 Issue: 01 |
Electrical Performance Of Microwave Boards
(Article)
Subject:
Circuit Breaker
,
Substrate
,
Dissipation Factor
Author:
George R.
Traut
page:
106
-
111
A 3-D Electromagnetic Simulator For High Frequency Applications
(Article)
Subject:
3-D Imaging
,
High Accuracy
,
Frequency
Author:
Jian X
Zheng
page:
112
-
118
Cracking Failures In Lead-On Chip Packages Induced By Chip Backside Contamination
(Article)
Subject:
Wafer
,
Adhesive
,
Package Modeling
Author:
Masazumi
Amagai
Kazuyoshi
Ebe
Hideo
Seno
page:
119
-
126
Elcectrical Design Of An Mcm Package For A Multi-Processor Dirgital System
(Article)
Subject:
Electrical Drives
,
Digital Systems
,
Mcm
Author:
Ali
Sarfaraz
Madhavan
Swaminathan
H
Bhatia
page:
127
-
143
Example Of A Mixed-Signal Global Positioning System (Gps) Receiver Using Mcm-L Packaging
(Article)
Subject:
Multichip Module
,
Global Population Mushrooms
,
Mixed-Single Design
Author:
Patrick J.
Zabinski
Barry K.
Gilbert
T
Keller
page:
13
-
17
Substrate Thickness Optimization For Liquid Immersion Cooled Silicon Multichip Modules
(Article)
Subject:
Liquid Intrusion
,
Multichip Modules
,
Substrate
Author:
Mehidi
Azimi
Richard C.
Jaeger
page:
144
-
149
To Cut Or Not To Cut A Thermomechanical Stress Analysis Of Polyimide Thin-Film On Ceramic Structures
(Article)
Subject:
Creep Test
,
Thermomecanique
,
Multilayer
Author:
Michael
Pecht
Hye-Young
Paik
S. Navin
Bhandarkar
page:
150
-
153
Open Repair Technologies For Mcm-D
(Article)
Subject:
Laser Chemical Vapor Deposition
,
Wire Bonding
,
Self-Inductance
Author:
Thomas A.
Wassick
Laertis
Economikos
page:
154
-
162
High Speed Electrical Characterization And Simulation Of A Pin Grid Array Package
(Article)
Subject:
High Speed
,
Grid Codes
,
Characterisation
Author:
Thomas W.
Goodman
Hiroyuki
Fujita
Arthur. T
Murphy
page:
163
-
167
A Low Temperature Co-Fired Ceramic Land Gride Array For High Speed Digital Applications
(Article)
Subject:
Temperature
,
Application
Author:
Thomas W.
Goodman
Hiroyuki
Fujita
Arthur. T
Murphy
page:
168
-
173
Case Study Of Ground Plane Inductance And Impications For Simulation
(Article)
Subject:
Simulation Design
,
Pga
,
Current
,
Redistribution
Author:
Brian
Young
page:
174
-
181
Cu/Photosensitve-Bcb Thin-Film Multilayer Technology For High-Performance Multichip Modules
(Article)
Subject:
Multichip Module
,
Mcm-D
,
Risc Maker
Author:
Tadanori
Shimoto
K
Utsumi
K.
Matsui
page:
18
-
22
A Micromachined Array Probe Card Characterization
(Article)
Subject:
Micromachines
,
Characterisation
,
Probes
Author:
Mark
Beiley
J
Leung
S. Simon
Wong
page:
184
-
191
Theermocompression Bonding Effects On Bump-Pad Adhesion
(Article)
Subject:
Experimental
,
Bond Shear Test
,
Bump-Pad Adhesion
Author:
Young-Gon G.
Kim
James H
White
Glenn Y.
Masada
page:
192
-
201
Estimation Of Aluminum And Gold Bond Wire Fusing And Fusing Time
(Article)
Subject:
Wirebonding Techniques
,
Deflection
,
Buckling
,
Ic Packages
Author:
A. A. O.
Tay
K. S.
Yeo
J. H.
Wu
page:
210
-
214
Mcm Substrate With High Capacitance
(Article)
Subject:
Thin Films
,
Mcm
,
Copper-Polyimide
Author:
Rokuro
Kambe
Toshikatsu
Takda
Masao
Kuroda
page:
23
-
27
Mcm-L Technology A Systems Cost Analysis For A High Volume Automotive Electronics Application
(Article)
Subject:
Mcm-L
,
Automotive Electronic Systems
,
System Cost
Author:
John L.
Evans
Larry E.
Bosley
R. Wayne
Johnson
page:
28
-
32
Largge Area Fine Line Patterning By Scanning Projection Lithography
(Article)
Subject:
Lithography
,
Large Angle Bends
,
Laser Absorption Sensor
,
Mcm
Author:
H
Muller
Yanrong
Yuan
Ronald E.
Sheets
page:
33
-
36
A Four Asic Mcm-C, Design For Manufacfacturability And The Next Generation Silicon
(Article)
Subject:
Mcm-C
,
Asic
,
Design For Manufacturability
Author:
Ed
Fulcher
Sada
Patil
page:
4
-
8
Thin Film Transfer Process For Low Cost Mcm-D Fabrication
(Article)
Subject:
Mcm
,
Low Cost
,
Thin Film Transistors
Author:
C.
Narayan
S.
Purushothaman
A.
Deutsch
page:
42
-
46
Integrated Flex Rigid-Flex Capability In A High Performance Mcm
(Article)
Subject:
Teflon
,
Flex Circuits
,
Single Chip Modules
,
Multichip Modules
Author:
David N.
Light
Charles R.
Davis
John S.
Kresge
page:
47
-
52
Reliability Comparison Of Two Metallurgies For Ceramic Ball Grid Array
(Article)
Subject:
Failure Mechanism
,
Relibility Assessment
Author:
Donald R.
Banks
Burnette R.
Gerke
Shyam
Mattay
page:
53
-
58
Development Of A Plasitc Encapsulated Multichip Technology For High Volume, Low Cost Commercial Electronics
(Article)
Subject:
Non Linear
,
Low Cost
,
Technology
Author:
J.
Wojnarowski
Eric J.
Wildi
page:
59
-
65
Concirrent Packaging Architecture Design
(Article)
Subject:
Concurrent Programs
,
Architecture
Author:
J. Peter
Krusius
Lipeng
Cao
page:
66
-
73
Simulation Of High Sped Interconnects Using A Convolution-Based Hierarchical Packaging Simulator
(Article)
Subject:
Simulation Of Construction
,
Convolution Algorithm
Author:
Mark S.
Basel
Paul D.
Franzon
Michael B.
Steer
page:
74
-
82
320 Gb/S High-Speed Atm Switching System Hardware Technologies Based On Copper-Polyimide Mcm
(Article)
Subject:
Mcm
,
B-Isdn
,
Atm
,
Copper-Polyimide
Author:
N.
Yamanaka
Kouichi
Genda
Shin-Ichi
Sasaki
page:
83
-
91
Mcm-L Product Development Process For Low-Cost Mcm, S
(Article)
Subject:
Mcm-L
,
New Product Development
,
Qualification
Author:
Patrick
Thompson
page:
9
-
12
Alforithms For Coupled Transient Simulation Of Circuits And Complicated 3-D Packaging
(Article)
Subject:
Interconnect
,
Packaging
,
Simulation
,
Multiprocessor
Author:
Luis Miguel
Silveira
Mattan
Kamon
Jacob
White
page:
92
-
98
Electrical Characterization Of The Interconnected Mesh Power System Imps Mcm Topology
(Article)
Subject:
Multichip Module
,
Cost Reduction
,
Power Distribution
,
Mesh
Author:
Leonard W/.
Schaper
Danny R.
Oldham
Yee L.
Low
page:
99
-
105
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